Jaskaran Singh Dhiman

I make sure the complex semiconductor advance packaging machines gets built right, on schedule, and can be repeated by someone other than me. The thread across 10+yrs in mfg - programs fail less on the engineering and more on the handoff, I close that gap. Today that means leading NPI programs of Advance Packaging across 𝑈𝑆, 𝑆𝑖𝑛𝑔𝑎𝑝𝑜𝑟𝑒, 𝑇𝑎𝑖𝑤𝑎𝑛, & 𝐾𝑜𝑟𝑒𝑎 𝑡𝑒𝑎𝑚𝑠. 𝐇𝐢𝐠𝐡𝐥𝐢𝐠𝐡𝐭𝐬 • Designed a Digital Build Plan, a Jira/Confluence-based digital manufacturing system that cuts documentation retrieval time from 30–40 minutes to <5 mins — new MES • Owned NPI production release of a Dual Head TCB end-to-end, including modules, driving roughly a 1.7x throughput increase • Took a Plasma Oxide Removal module from prototype to production for ultra-low pitch IC’s...